Samsung M393A4K40EB3-CWE 32-GB DDR4-3200 RDIMM (2RX4) ECC Зарегистрированный модуль памяти сервера
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  • Номер детали:M393A4K40EB3-CWE
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Title

Samsung M393A4K40EB3-CWE 32-GB DDR4-3200 RDIMM (2Rx4) ECC Registered Server Memory Module

Keywords

Samsung M393A4K40EB3-CWE, 32GB DDR4-3200, ECC Registered RDIMM, Dual Rank x4, PC4-25600 module, server memory upgrade, Samsung RDIMM memory, CL22 latency

Description

The Samsung M393A4K40EB3-CWE is a **32 GB DDR4-3200 RDIMM** module designed for enterprise and server applications requiring **ECC registered memory**. It features dual-rank (2R) with x4 organization, offering strong performance and reliability for high-density server environments. 

This memory module operates at 1.2 V and supports the PC4-25600 standard, which corresponds to DDR4-3200 MT/s speed. It also includes a register to support better signal integrity and clock/command control, useful when multiple DIMMs are used in configurations with many memory channels.

Cas latency timing is **CL22**, with the module having 288 pins (standard RDIMM form factor). It supports 2 ranks, meaning it's capable of being used in systems that benefit from rank interleaving for improved memory bandwidth. 

This module is ideal for upgrading servers or workstations that support DDR4-3200 RDIMM ECC memory—especially when you need to balance cost and performance in multi-DIMM/server configurations. Whether you need to increase capacity for virtualization, databases, caching, or compute workloads, this module is reliable.

Samsung’s official spec confirms the M393A4K40EB3-CWE is in mass production, which helps with supply and consistency. Being from a first-tier DRAM maker like Samsung ensures better binning, quality, and likely warranty or replacement availability. 

Key Features

  • 32 GB capacity per module, allowing meaningful increases in server memory without many modules.
  • DDR4-3200 MT/s speed provides modern throughput for memory-intensive operations. 32GB DDR4-3200
  • ECC Registered RDIMM design for error correction and server-class stability. ECC Registered RDIMM
  • Dual Rank ×4 chip configuration improves effective bandwidth and works well with multi-channel memory controllers. Dual Rank x4
  • CL22 latency, acceptable for most workloads; good trade-off between speed and cost. CL22 latency
  • Low voltage operation at 1.2 V helps reduce power consumption and heat compared to older modules.
  • Standard 288-pin RDIMM form factor compatible with many Intel Xeon, AMD EPYC, and other server platforms. PC4-25600 module

Configuration

ComponentSpecification / Details
Part Number / SKUSamsung M393A4K40EB3-CWE
Capacity32 GB per module
Memory TypeDDR4 SDRAM Registered (RDIMM)
Speed3200 MT/s (PC4-25600)
Voltage1.2 V
Rank / Organization2R (dual rank) ×4
Form Factor288-pin RDIMM
Cas LatencyCL22
Error CheckingECC (Error-Correcting Code)
Usage StatusMass Production / In Stock from vendors (new / refurbished) depending on seller

Compatibility

The Samsung module is compatible with server platforms that support DDR4 Registered ECC RDIMM memory. That includes many Intel Xeon Scalable (2nd/3rd Gen) and AMD EPYC (1st/2nd Gen) platforms that support DDR4-3200 speed. Always check the motherboard / server memory compatibility matrix for maximum supported speed and number of ranks. 

Using a single module or pairs is usually fine; when installing multiple modules, follow DIMM slot population guidelines to enable full memory bandwidth—populating all memory channels gives best performance. Mixing modules with identical specs is recommended to avoid instability.

This module operates at standard voltage 1.2 V and standard form factor 288-pin, making it compatible with standard RDIMM slots, subject to BIOS / firmware recognizing exact part. Latency (CL22) is common; some platforms may downclock or adjust timings if mixed with lower-speed memory.

If replacing older memory, confirm that the memory controller supports DDR4-3200; if the system only supports DDR4-2933 or 2666, module will drop down. ECC functionality and registered buffering help when the system is under heavy memory load or using many modules.

Usage Scenarios

1) Server RAM Upgrade: Perfect for upgrading server capacity (e.g. adding to existing modules) in virtualization hosts, database servers, or web farms, providing better multitasking and buffer cache. server memory upgrade

2) Dense Compute Nodes: In high-performance compute nodes or AI/ML preprocessing where memory bandwidth and capacity are important but GPU memory isn’t the bottleneck, these RDIMMs help feeding CPU with sufficient memory.

3) Enterprise Storage Controllers / File Servers: For workloads involving caching, metadata operations, or for host systems managing storage, ECC-RDIMM ensures data integrity; 32 GB per module allows good capacity without excessive power/slot use.

4) Mixed Workload Environments: Web servers + DB + analytics on same box, where different processes require memory—having 32 GB modules means cost-efficient scaling.

5) Backup / DR / Secondary Servers: For non-critical but still performance-sensitive servers used for backups, DR, secondary services, this module provides reliability and performance without over-spending.

Frequently Asked Questions

  1. Q: What is the difference between “Dual Rank ×4” and other rank configurations like ×8 or single-rank?
    A: Dual-rank means there are two sets of memory chips that the controller can interleave, which improves throughput when more than one rank is in use. The ×4 organization indicates how many data bits per chip. Modules with ×8 may have fewer chips or different layout, which can impact latency or capacity per chip. The M393A4K40EB3-CWE’s 2R×4 is a trade-off offering good capacity + bandwidth.
  2. Q: Will this module run at full 3200 MT/s in my server?
    A: Only if the motherboard / CPU memory controller supports 3200 MT/s on all occupied DIMM slots and it is DDR4-3200 validated. If mixed with slower DIMMs or in slots that share channels, speed might be reduced (drop to 2933, 2666 etc). Always check vendor’s memory compatibility lists.

  3. Q: Can I mix this Samsung module with other Samsung RDIMMs or with other brands?
    A: Mixing with identical spec modules (same speed, rank, organization) from same or high quality brands tends to be safe. But mixing with different specs (speed / rank / organisation) may reduce achievable speed, increase latency or cause instability. Ideals: same CL, same voltage, same RDIMM type.

  4. Q: Does this module consume much power or generate heat?
    A: It runs at standard DDR4 1.2 V and typical power draw for 32 GB RDIMM at DDR4-3200 is modest; however, under heavy load (many DIMMs, high utilization) heat and power will scale. Ensure server has adequate airflow and cooling, particularly near memory banks.

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